DocumentCode
502621
Title
System event triggered latch-up in IC chips: test issues and chip level protection design
Author
Dening Wang ; Marum, S. ; Kemper, W. ; McLain, D.
Author_Institution
Texas Instrum. Inc., Sherman, TX, USA
fYear
2006
fDate
10-15 Sept. 2006
Firstpage
1
Lastpage
7
Abstract
A growing trend in the industry today is for IC manufacturers to provide components with protection against system level events. Such events may be system level ESD, surge/lightning tests, or any other system level tests that may apply a transient stress to IC pins. Recent studies show IC devices that pass regular DC latch-up testing can still be triggered to latch-up and lock-up modes by system level events. Providing components with built-in latch-up/lock-up immunity to system events requires both careful test methodology development and extra design effort. This paper discusses efforts to set up an IC level test environments for system events and IC level design efforts to enhance interface IC devices with latch-up immunity to system events.
Keywords
electrostatic discharge; integrated circuit design; integrated circuit manufacture; integrated circuit testing; DC latch-up testing; IC chip test; IC manufacturing industry; chip level protection design; integrated circuit pins; lock-up modes; surge-lightning test; system event triggered latch-up; system level ESD test; transient stress; Circuit testing; Electrostatic discharge; Integrated circuit modeling; Integrated circuit testing; Pins; Power system modeling; Protection; Stress; Surges; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Overstress/Electrostatic Discharge Symposium, 2006. EOS/ESD '06.
Conference_Location
Anaheim, CA
Print_ISBN
978-1-5853-7115-0
Type
conf
Filename
5256808
Link To Document