DocumentCode :
502685
Title :
Technology CAD evaluation of BiCMOS protection structures operation including spatial thermal runaway
Author :
Vashchenko, Vladislav ; Concannon, Ann ; Beek, Marcel Ter ; Hopper, Peter
Author_Institution :
NSC, 2900 Semiconductor Drive, M/S E-155, Santa Clara, CA 95052-8090, USA
fYear :
2002
fDate :
6-10 Oct. 2002
Firstpage :
101
Lastpage :
110
Abstract :
A 2-D simulation approach that takes into account the 3D effects of electro-thermal instability during ESD operation, is presented. The method is used to provide physical evaluation of a safe operation regime for BiCMOS ESD protection structures and circuits. ESD stress induced hot spot formation using 3D simulation has been presented for the case of a simplified snapback n-MOS device.
Keywords :
BiCMOS integrated circuits; Protection;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
2002 Electrical Overstress/Electrostatic Discharge Symposium, 2002. EOS/ESD '02.
Conference_Location :
Charlotte, NC, USA
Print_ISBN :
978-1-5853-7040-5
Electronic_ISBN :
978-1-5853-7040-5
Type :
conf
Filename :
5267035
Link To Document :
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