DocumentCode :
502992
Title :
A study of esd damage to a device inside a metal enclosure
Author :
Wallash, Albert
Author_Institution :
Hitachi Global Storage Technol., San Jose, CA, USA
fYear :
2005
fDate :
8-16 Sept. 2005
Firstpage :
1
Lastpage :
9
Abstract :
The ESD immunity of a system consisting of a metal box with an ESD sensitive device that is coupled to the inside and outside of the box is studied experimentally and through SPICE and 3D electromagnetic simulations. It is found that the combination of wire feedthroughs and an impedance imbalance across the terminals of the device results in significant current flow through the device. It is concluded that simulations combined with experimental measurements open up the possibility of predicting the ESD immunity of a system containing an extremely ESD sensitive device.
Keywords :
SPICE; electrostatic discharge; 3D electromagnetic simulations; ESD damage; ESD sensitive device; SPICE; metal enclosure; Circuit testing; Coupling circuits; Electromagnetic coupling; Electromagnetic measurements; Electrostatic discharge; Insulation; Preamplifiers; Printed circuits; SPICE; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium, 2005. EOS/ESD '05.
Conference_Location :
Tucson, AZ
Print_ISBN :
978-1-58537-069-6
Electronic_ISBN :
978-1-58537-069-6
Type :
conf
Filename :
5271747
Link To Document :
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