Title :
Partitioned HBM test — A new method to perform HBM tests on complex devices
Author :
Gaertner, R. ; Aburano, R. ; Brodbeck, T. ; Gossner, H. ; Schaafhausen, J. ; Stadler, W. ; Zaengl, F.
Author_Institution :
Infineon Technol. AG, Munich, Germany
Abstract :
The partitioned HBM test is a new method to test complex devices with a high number of domains. By splitting the test into well defined sections overstress due to multi-zapping is reduced. All design relevant failures are addressed and only non-instructional multi-zapping induced failures are avoided. Furthermore the clear structure of the applied stress allows finding the root cause of the failures easily.
Keywords :
failure analysis; integrated circuit testing; complex devices; microelectronic devices; multizapping induced failures; partitioned human body model test; Costs; Electrostatic discharge; IEC standards; Manufacturing; Microelectronics; Military standards; Performance evaluation; Pins; Power supplies; System testing;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium, 2005. EOS/ESD '05.
Conference_Location :
Tucson, AZ
Print_ISBN :
978-1-58537-069-6
Electronic_ISBN :
978-1-58537-069-6
