DocumentCode
503019
Title
The influence of implanted sub-collector on CMOS latchup robustness
Author
Voldman, Steven H. ; Gebreselasie, Ephrem G.
Author_Institution
IBM Microelectron., Essex Junction, VT, USA
fYear
2005
fDate
8-16 Sept. 2005
Firstpage
1
Lastpage
10
Abstract
This paper discusses the integration of sub-collector implants into a dual-well CMOS for improvement in CMOS latchup robustness. Experimental work demonstrates CMOS latchup tradeoffs exist between the enhancement of the npn bipolar current gain, betanpn and reduction of the pnp bipolar current gain, betapnp. Additionally, the integration of sub-collectors, as well as trench isolation (TI) and deep trench (DT) isolation structures into CMOS dual-well structures will be highlighted.
Keywords
CMOS integrated circuits; isolation technology; CMOS dual-well structures; CMOS latchup robustness; deep trench isolation; dual-well CMOS; implanted subcollector; npn bipolar current gain; pnp bipolar current gain; subcollector implants integration; BiCMOS integrated circuits; CMOS technology; Electrostatic discharge; Implants; Isolation technology; MOSFET circuits; Microelectronics; Robustness; Telephony; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Overstress/Electrostatic Discharge Symposium, 2005. EOS/ESD '05.
Conference_Location
Tucson, AZ
Print_ISBN
978-1-58537-069-6
Electronic_ISBN
978-1-58537-069-6
Type
conf
Filename
5271818
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