• DocumentCode
    503019
  • Title

    The influence of implanted sub-collector on CMOS latchup robustness

  • Author

    Voldman, Steven H. ; Gebreselasie, Ephrem G.

  • Author_Institution
    IBM Microelectron., Essex Junction, VT, USA
  • fYear
    2005
  • fDate
    8-16 Sept. 2005
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    This paper discusses the integration of sub-collector implants into a dual-well CMOS for improvement in CMOS latchup robustness. Experimental work demonstrates CMOS latchup tradeoffs exist between the enhancement of the npn bipolar current gain, betanpn and reduction of the pnp bipolar current gain, betapnp. Additionally, the integration of sub-collectors, as well as trench isolation (TI) and deep trench (DT) isolation structures into CMOS dual-well structures will be highlighted.
  • Keywords
    CMOS integrated circuits; isolation technology; CMOS dual-well structures; CMOS latchup robustness; deep trench isolation; dual-well CMOS; implanted subcollector; npn bipolar current gain; pnp bipolar current gain; subcollector implants integration; BiCMOS integrated circuits; CMOS technology; Electrostatic discharge; Implants; Isolation technology; MOSFET circuits; Microelectronics; Robustness; Telephony; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/Electrostatic Discharge Symposium, 2005. EOS/ESD '05.
  • Conference_Location
    Tucson, AZ
  • Print_ISBN
    978-1-58537-069-6
  • Electronic_ISBN
    978-1-58537-069-6
  • Type

    conf

  • Filename
    5271818