DocumentCode
503046
Title
Exploring a clean ESD laminate and ionic contamination methodology
Author
Neteler, J.G. ; Tew, C.P. ; Lee, Elizebeth S C ; Lei, Z.P.
Author_Institution
Senawang Laminating Technol. Sdn Bhd, Sembilan, Malaysia
fYear
2003
fDate
21-25 Sept. 2003
Firstpage
1
Lastpage
9
Abstract
Users of clean ESD flexible packaging films have historically faced the compromise of choosing a product optimized for either cleanliness or ESD properties. This clean ESD flexible packaging film exhibited both high levels of cleanliness and good electrical properties. The product evaluation includes automated thermo-desorption dynamic headspace, ionic contamination and non-volatile residue analyses. Three Ion Pac columns with two eluent systems were evaluated to overcome the interference of an organo-ligand.
Keywords
chromatography; contamination; electronics packaging; electrostatic discharge; flexible structures; laminates; organic compounds; surface cleaning; thermally stimulated desorption; ESD flexible packaging films; automated thermo-desorption dynamic headspace; clean ESD laminate; eluent system; ion pac columns; ionic contamination methodology; nonvolatile residue analysis; organo-ligand interference; product evaluation; surface cleanliness; Conductivity; Contamination; Detectors; Electrostatic discharge; Electrostatic interference; Laminates; Ovens; Packaging; Positron emission tomography; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Overstress/Electrostatic Discharge Symposium, 2003. EOS/ESD '03.
Conference_Location
Las Vegas, NV
Print_ISBN
978-1-5853-7057-3
Electronic_ISBN
978-1-5853-7057-3
Type
conf
Filename
5272009
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