• DocumentCode
    503046
  • Title

    Exploring a clean ESD laminate and ionic contamination methodology

  • Author

    Neteler, J.G. ; Tew, C.P. ; Lee, Elizebeth S C ; Lei, Z.P.

  • Author_Institution
    Senawang Laminating Technol. Sdn Bhd, Sembilan, Malaysia
  • fYear
    2003
  • fDate
    21-25 Sept. 2003
  • Firstpage
    1
  • Lastpage
    9
  • Abstract
    Users of clean ESD flexible packaging films have historically faced the compromise of choosing a product optimized for either cleanliness or ESD properties. This clean ESD flexible packaging film exhibited both high levels of cleanliness and good electrical properties. The product evaluation includes automated thermo-desorption dynamic headspace, ionic contamination and non-volatile residue analyses. Three Ion Pac columns with two eluent systems were evaluated to overcome the interference of an organo-ligand.
  • Keywords
    chromatography; contamination; electronics packaging; electrostatic discharge; flexible structures; laminates; organic compounds; surface cleaning; thermally stimulated desorption; ESD flexible packaging films; automated thermo-desorption dynamic headspace; clean ESD laminate; eluent system; ion pac columns; ionic contamination methodology; nonvolatile residue analysis; organo-ligand interference; product evaluation; surface cleanliness; Conductivity; Contamination; Detectors; Electrostatic discharge; Electrostatic interference; Laminates; Ovens; Packaging; Positron emission tomography; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/Electrostatic Discharge Symposium, 2003. EOS/ESD '03.
  • Conference_Location
    Las Vegas, NV
  • Print_ISBN
    978-1-5853-7057-3
  • Electronic_ISBN
    978-1-5853-7057-3
  • Type

    conf

  • Filename
    5272009