DocumentCode
503076
Title
Transmission line pulsed photo emission microscopy as an ESD troubleshooting method
Author
van Zwol, J. ; Kemper, W. ; Bruin, P.
Author_Institution
Philips Semicond., Nijmegen, Netherlands
fYear
2003
fDate
21-25 Sept. 2003
Firstpage
1
Lastpage
8
Abstract
Standard or transmission line pulse ESD testing combined with failure analysis will not always reveal the cause of ESD weakness in an IC. The paper proposes the combination of photo emission microscopy and TLP as a troubleshooting tool. Two cases are discussed where the advantage of this combination was essential to solve the particular ESD problem in the IC.
Keywords
electrostatic discharge; integrated circuit testing; optical microscopy; transmission lines; ESD troubleshooting method; failure analysis; integrated circuit testing; transmission line pulsed photo emission microscopy; Circuit simulation; Electrostatic discharge; Failure analysis; Integrated circuit testing; Optical microscopy; Protection; Robustness; Scanning electron microscopy; Stress; Transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Overstress/Electrostatic Discharge Symposium, 2003. EOS/ESD '03.
Conference_Location
Las Vegas, NV
Print_ISBN
978-1-5853-7057-3
Electronic_ISBN
978-1-5853-7057-3
Type
conf
Filename
5272039
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