Title :
Transmission line pulsed photo emission microscopy as an ESD troubleshooting method
Author :
van Zwol, J. ; Kemper, W. ; Bruin, P.
Author_Institution :
Philips Semicond., Nijmegen, Netherlands
Abstract :
Standard or transmission line pulse ESD testing combined with failure analysis will not always reveal the cause of ESD weakness in an IC. The paper proposes the combination of photo emission microscopy and TLP as a troubleshooting tool. Two cases are discussed where the advantage of this combination was essential to solve the particular ESD problem in the IC.
Keywords :
electrostatic discharge; integrated circuit testing; optical microscopy; transmission lines; ESD troubleshooting method; failure analysis; integrated circuit testing; transmission line pulsed photo emission microscopy; Circuit simulation; Electrostatic discharge; Failure analysis; Integrated circuit testing; Optical microscopy; Protection; Robustness; Scanning electron microscopy; Stress; Transmission lines;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium, 2003. EOS/ESD '03.
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-5853-7057-3
Electronic_ISBN :
978-1-5853-7057-3
