ALX permanent polymer dielectrics for microelectronic packaging applications

Author

Garrou, Philip ; Huffman, Alan ; Piascik, Jeffery

Author_Institution

Microelectron. Consultants of NC, Research Triangle Park, NC, USA

fYear

2009

fDate

15-18 June 2009

Firstpage

1

Lastpage

9

Abstract

In this paper we present the results of a study done to compare the new Asahi Glass ALX polymers with other microelectronic polymers in typical WLP structures. We present property data on ALX-211, including spin speed curves and resolution plots, planarization, thermal stability and stress data and adhesion as evaluated using polymer bump shear testing. We have examined the processing of ALX-211 and developed a standard process flow for these materials. We have used ALX-211 in a typical bump-on-polymer process flow, with eutectic Sn/Pb solder bumps, and compared its performance to that of BCB through solder bump shear testing.

Keywords

adhesion; dielectric materials; integrated circuit packaging; internal stresses; planarisation; polymers; thermal stability; ALX permanent polymer dielectrics; ALX-211; Asahi Glass ALX polymers; WLP structures; adhesion; bump-on-polymer process flow; eutectic Sn-Pb solder bumps; microelectronic packaging; planarization; polymer bump shear testing; resolution plots; spin speed curves; stress property; thermal stability; Adhesives; Dielectrics; Glass; Microelectronics; Packaging; Planarization; Polymers; Testing; Thermal stability; Thermal stresses; ALX; WLP; bump-on-polymer; photo polymer;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronics and Packaging Conference, 2009. EMPC 2009. European

Conference_Location

Rimini

Print_ISBN

978-1-4244-4722-0

Electronic_ISBN

978-0-6152-9868-9

Type

conf

Filename

5272853