DocumentCode :
503103
Title :
Pot life improvement of low temperature and high-speed curable anisotropic conductive adhesive (ACA)
Author :
Jong-Hyun Lee ; Kim, Ju-Hyung ; Hyun, Chang-Yong
Author_Institution :
Dept. of Mater. Sci. & Eng., Seoul Nat. Univ. of Technol., Seoul, South Korea
fYear :
2009
fDate :
15-18 June 2009
Firstpage :
1
Lastpage :
5
Abstract :
In this study, the imidazole-based curing accelerator powders were coated with a chosen agent to increase the pot life of ACA resin formulation. To accomplish this simple procedure, the coating processes were tried with a vapor or molten state of the coating agent. The coating processes with the vapor state could not be considered as an effective conformal coating method. However, a coating process using the molten state was effective at increasing the pot life, and showed minor effect with regard to the curing rate and processability of final formulation.
Keywords :
coating techniques; conductive adhesives; curing; anisotropic conductive adhesive; coating agent; conformal coating; curing accelerator powders; pot life improvement; vapor state; Anisotropic magnetoresistance; Conductive adhesives; Consumer electronics; Electronics packaging; Lamination; Protection; Resists; Shape; Temperature; Thermal resistance; ACA (anisotropic conductive adhesive); RFID assembly; chip bonding; high-speed curing; pot life;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics and Packaging Conference, 2009. EMPC 2009. European
Conference_Location :
Rimini
Print_ISBN :
978-1-4244-4722-0
Electronic_ISBN :
978-0-6152-9868-9
Type :
conf
Filename :
5272864
Link To Document :
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