• DocumentCode
    503103
  • Title

    Pot life improvement of low temperature and high-speed curable anisotropic conductive adhesive (ACA)

  • Author

    Jong-Hyun Lee ; Kim, Ju-Hyung ; Hyun, Chang-Yong

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Seoul Nat. Univ. of Technol., Seoul, South Korea
  • fYear
    2009
  • fDate
    15-18 June 2009
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    In this study, the imidazole-based curing accelerator powders were coated with a chosen agent to increase the pot life of ACA resin formulation. To accomplish this simple procedure, the coating processes were tried with a vapor or molten state of the coating agent. The coating processes with the vapor state could not be considered as an effective conformal coating method. However, a coating process using the molten state was effective at increasing the pot life, and showed minor effect with regard to the curing rate and processability of final formulation.
  • Keywords
    coating techniques; conductive adhesives; curing; anisotropic conductive adhesive; coating agent; conformal coating; curing accelerator powders; pot life improvement; vapor state; Anisotropic magnetoresistance; Conductive adhesives; Consumer electronics; Electronics packaging; Lamination; Protection; Resists; Shape; Temperature; Thermal resistance; ACA (anisotropic conductive adhesive); RFID assembly; chip bonding; high-speed curing; pot life;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics and Packaging Conference, 2009. EMPC 2009. European
  • Conference_Location
    Rimini
  • Print_ISBN
    978-1-4244-4722-0
  • Electronic_ISBN
    978-0-6152-9868-9
  • Type

    conf

  • Filename
    5272864