DocumentCode
503103
Title
Pot life improvement of low temperature and high-speed curable anisotropic conductive adhesive (ACA)
Author
Jong-Hyun Lee ; Kim, Ju-Hyung ; Hyun, Chang-Yong
Author_Institution
Dept. of Mater. Sci. & Eng., Seoul Nat. Univ. of Technol., Seoul, South Korea
fYear
2009
fDate
15-18 June 2009
Firstpage
1
Lastpage
5
Abstract
In this study, the imidazole-based curing accelerator powders were coated with a chosen agent to increase the pot life of ACA resin formulation. To accomplish this simple procedure, the coating processes were tried with a vapor or molten state of the coating agent. The coating processes with the vapor state could not be considered as an effective conformal coating method. However, a coating process using the molten state was effective at increasing the pot life, and showed minor effect with regard to the curing rate and processability of final formulation.
Keywords
coating techniques; conductive adhesives; curing; anisotropic conductive adhesive; coating agent; conformal coating; curing accelerator powders; pot life improvement; vapor state; Anisotropic magnetoresistance; Conductive adhesives; Consumer electronics; Electronics packaging; Lamination; Protection; Resists; Shape; Temperature; Thermal resistance; ACA (anisotropic conductive adhesive); RFID assembly; chip bonding; high-speed curing; pot life;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics and Packaging Conference, 2009. EMPC 2009. European
Conference_Location
Rimini
Print_ISBN
978-1-4244-4722-0
Electronic_ISBN
978-0-6152-9868-9
Type
conf
Filename
5272864
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