3D packaging and supply chain management

As integration density on chip level is slowing down the importance and added value of advanced packaging is rising. Even semiconductor manufacturers admit that the way forward is to work on packaging and interconnect. One of the promising solutions is to go to 3D packaging but most of these technologies have been applied slower than anticipated and pioneering companies may run into financial trouble. One additional reason for these problems are the growing supply chain complexities, isolating material suppliers, package developers and producers from end product manufacturers like OEMs. Globalization and outsourcing add to these problems. This paper will look at some 3D packaging technologies, analyzing some solutions and implementations including some viewpoints on how they fulfil the requirements of system houses. We will also stress the importance of technology organizations like IMAPS and HDPUG and how they will bridge gaps in the supply chain knowledge. Indeed package developers need to assure a customer base for their developing work, but that is not enough! Competing suppliers need to coordinate efforts to assure they fit in the global community and OEMs need to assure they have multiple sources to rely on and that the suppliers´ development expenses are shared among multiple OEMs! Networking is needed both up and down the supply chains but also laterally between competitors.