Title :
Fully embedded optical and electrical interconnections in flexible foils
Author :
Bosman, E. ; Van Steenberge, G. ; Geerinck, P. ; Vanfleteren, J. ; Van Daele, P.
Author_Institution :
IMEC, Ghent Univ., Ghent, Belgium
Abstract :
This paper presents the development of a technology platform for the full integration of opto-electronic and electronic components, as well as optical interconnections in a flexible foil. A technology is developed to embed ultra thin (20 mum) VCSEL´s and Photodiodes in layers of optical transparent material. These layers are sandwiched in between two Polyimide layers to get a flexible foil with a final stack thickness of 150 mum. Optical waveguides are structured by photolithography in the optical layers and pluggable mirror components couple the light from the embedded opto-electronics in and out of the waveguides. Besides optical links and optoelectronic components, electrical circuitry is also embedded by means of embedded copper tracks and thinned down Integrated Circuits (20 mum). Optical connection towards the outer world is realized by U-groove passive alignment coupling of optical fibers with the embedded waveguides.
Keywords :
foils; integrated circuit interconnections; integrated optoelectronics; mirrors; optical fibre couplers; optical interconnections; optical links; optical waveguides; photodiodes; photolithography; polymers; surface emitting lasers; U-groove passive alignment coupling; VCSEL; electrical circuitry; electrical interconnection; embedded copper tracks; embedded waveguides; flexible foils; optical fibers; optical interconnections; optical links; optical transparent material; optical waveguides; optoelectronic components; photodiodes; pluggable mirror components; polyimide layers; size 150 mum; thinned down integrated circuits; Coupling circuits; Electronic components; Integrated circuit interconnections; Optical coupling; Optical devices; Optical interconnections; Optical waveguide components; Optical waveguides; Photodiodes; Vertical cavity surface emitting lasers; Opto-electronic packaging; VCSEL; embedding; flexible; optical interconnect; thin chip;
Conference_Titel :
Microelectronics and Packaging Conference, 2009. EMPC 2009. European
Conference_Location :
Rimini
Print_ISBN :
978-1-4244-4722-0
Electronic_ISBN :
978-0-6152-9868-9
