Author_Institution :
PFSE, Panasonic Ind. Eur. GmbH, Haar, Germany
Abstract :
Flipchip Technology is getting more and more important for future packaging solutions. This presentation gives an overview of different Flipchip Technology Solutions provided by industry. Mainstream Technologies such as C4 and ACF / ACP processes are explained. In special focus will be recently developed new processes to improve: Thermosonic Gold to Gold Interconnect (GGI) Process and Encapsulant Solder Connect (ESC) Process. Those being very fast and highly reliable. This is why they are suitable for further future miniturization. They cover a wide range of industrie´s product applications. Typical characteristics and process parameters for ESC and GGI will be described and analysed. Reliability data will be shown and explained. Both processes are suitable to be used in Chip on Board (COB), Waferlevel (COW) and Embedded Packaging Technology & Assembly. Some examples of how to use Flipchip processes for embedding active components to FR4 Printed Circuit boards (PCB) are shown and explained.
Keywords :
chip-on-board packaging; flip-chip devices; solders; ESC; GGI; chip on board; embedded packaging technology & assembly; encapsulant solder connect process; flip-chip technology; printed circuit boards; thermosonic gold to gold interconnect; waferlevel; Assembly; Cleaning; Europe; Gold; Integrated circuit interconnections; Packaging; Plasma materials processing; Process design; Soldering; Substrates; P1. Flipchip Embedded Technology Miniturization, METAL JOINT, CONTACTING; P2. machine parameters, ESC process design, Process flow, Process & Quality criteria; P3. cross sections, GGI ultrasonic flipchip, Process conditions, Material parameters, machine parameters, process window; P4. Status of Industry, organic substrates (Flex and FR4), heated bonding tool, substrate temperature; P5. Embedding components into Organic subtrates, high yield, shielding characteristics, SIMPACT, Laser Cavity, Conclusion;
