Title :
X-ray nanoCT of interconnections in IC packages: Visualizing of internal 3D-structures with submicrometer resolution
Author :
Luebbehuesen, J. ; Roth, H. ; Neubrand, T. ; Brunke, O.
Author_Institution :
Phoenix|x-ray, GE Sensing & Inspection Technol. GmbH, Wunstorf, Germany
Abstract :
Miniaturised and concealed electrical interconnections in IC packages including copper and gold wire bonds, flip chips and microvias were inspected by nanofocus X-ray tube technology and nanofocus computed tomography. The 2D and 3D X-ray imaging technology is concisely described and various analysis results and defect examples at sub-micrometer resolution are presented.
Keywords :
X-ray imaging; computerised tomography; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; lead bonding; 2D X-ray imaging; 3D X-ray imaging; X-ray nanocomputed tomography; copper wire bonds; flip chips; gold wire bonds; integrated circuit interconnections; integrated circuit packages; internal 3D-structures; microvias; nanofocus X-ray tube technology; nanofocus computed tomography; submicrometer resolution; Computed tomography; Copper; Flip chip; Gold; Image analysis; Image resolution; Integrated circuit packaging; Visualization; Wire; X-ray imaging; 3D micro-analysis; high resolution Computed Tomography; nanoCT; nanofocus X-ray inspection;
Conference_Titel :
Microelectronics and Packaging Conference, 2009. EMPC 2009. European
Conference_Location :
Rimini
Print_ISBN :
978-1-4244-4722-0
Electronic_ISBN :
978-0-6152-9868-9
