Title :
Compression molding solutions for various high end package and cost savings for standard package applications
Author :
Matsutani, Hiroshi
Author_Institution :
Towa Corp., Kyoto, Japan
Abstract :
There has been great progress on compression molding technology and equipment. This technology is used not only for most advanced semiconductor package, but also regular BGA type substrate molding to reduce CoO. There is wide range of applications including LED production. The system for mass production is fully developed and is ready to support the production. Compression molding is the next Defacto standard product in mold industry.
Keywords :
ball grid arrays; compression moulding; light emitting diodes; substrates; Defacto standard product; LED production; compression molding solutions; cost savings; high end package; mold industry; regular BGA type substrate molding; semiconductor package; Compression molding; Computer networks; Costs; Digital systems; Distributed computing; Electronics packaging; Finite element methods; Materials reliability; Shape; Tensile stress;
Conference_Titel :
Microelectronics and Packaging Conference, 2009. EMPC 2009. European
Conference_Location :
Rimini
Print_ISBN :
978-1-4244-4722-0
Electronic_ISBN :
978-0-6152-9868-9
