DocumentCode :
503151
Title :
Closing technology knowledge gaps: Projects arising from the iNEMI technology roadmap
Author :
Pfahl, Bob ; Arnold, Jim ; O´Malley, Grace
Author_Institution :
iNEMI, VA, USA
fYear :
2009
fDate :
15-18 June 2009
Firstpage :
1
Lastpage :
5
Abstract :
iNEMI has been publishing its technology roadmap biannually for the last 14 years. The strength of these roadmaps has been the depth of the knowledge from experts worldwide combined with the breath of view taken across the whole electronic manufacturing supply chain. Every new roadmap helps identify the technology gaps in various aspects of the supply chain. These gaps then stimulate and encourage dialogue to develop consensus-based strategies resulting in industry-based joint project work or promoting research areas to the academic communities. Since 2007, there has been a focus on three main technology areas for iNEMI industry-based projects: energy and the environment, miniaturization and medical electronics. This paper will cover the goals of these three areas and the strategies being adopted to address the present and future technology gaps, as identified in the most recent roadmaps. Results from key projects in the three areas will be presented. These will include projects on Pb-free alloy alternatives and HFR-free substrates; higher density testing and nanosolders, and medical components reliability.
Keywords :
biomedical electronics; electronics industry; reliability; solders; supply chains; testing; closing technology knowledge gaps; consensus-based strategy; electronic manufacturing supply chain; higher-density testing; iNEMI technology roadmap; international electronics manufacturing initiative; lead-free alloy; medical component reliability; nanosolders; Assembly; Composite materials; Electronic equipment testing; Electronics industry; Industrial electronics; Life estimation; Manufacturing industries; Medical tests; Supply chains; Tin; Boundary Scan Test; Environmental; Functional Test; HFR-free; Medical Electronics; Miniaturization; Nano-solder; Pb-free;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics and Packaging Conference, 2009. EMPC 2009. European
Conference_Location :
Rimini
Print_ISBN :
978-1-4244-4722-0
Electronic_ISBN :
978-0-6152-9868-9
Type :
conf
Filename :
5272913
Link To Document :
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