Stacking of full rebuilt wafers for sip and abandoned sensors/applications

Author

Val, Christian ; Couderc, Pascal ; Lartigues, Pierre

Author_Institution

3D PLUS, Buc, France

fYear

2009

fDate

15-18 June 2009

Firstpage

1

Lastpage

9

Abstract

Miniaturisation for commercial applications demands very high interconnection densities and low costs. Wiser for former experiences, multi-chip modules, wafer scale integration, 3-D modules for space, defense and professional (3D Plus) applications, we learned that the yield constituted an important part of the production costs. The WDoD process allows to stack known good rebuilt wafer (KGRW) only. Several applications in the medical and industrial domains have been presented. This extremely important densification of 10 to 20 levels per mm with only 100 mum around the largest die allows to launch extremely ambitious applications with memories, systems in package and abandoned sensors.

Keywords

densification; integrated circuit interconnections; multichip modules; stacking; system-in-package; wafer-scale integration; 3D Plus applications; 3D modules; SiP; WDoD process; abandoned sensors; densification; full rebuilt wafers; interconnection densities; multichip modules; stacking; systems in package; wafer scale integration; Multichip modules; Packaging; Random access memory; Semiconductor device manufacture; Silicon; Stacking; Through-silicon vias; Wafer bonding; Wafer scale integration; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronics and Packaging Conference, 2009. EMPC 2009. European

Conference_Location

Rimini

Print_ISBN

978-1-4244-4722-0

Electronic_ISBN

978-0-6152-9868-9

Type

conf

Filename

5272941