DreamPAK – Small form factor package

Recently there have been several developments in the areas of small form factor and high-density lead frame based IC packages. These packages have the benefits of occupying smaller PC board area, lower assembly material consumption due to their smaller volume package construction, and good thermal dissipation properties. Another area of recent development in packaging integration is system in package SIP. A SIP package can integrate various ICs in a package. For example; CPU, logic, analog, digital, discrete and passive components can be integrated in a single package. SIP provides a high level of integration capability of several functional chips. It provides good miniaturization capability for hand held portable electronic communication devices. High-density capability and flexibility in design using a substrate like chip carrier will be covered. Design flexibility covering several main stream packages equivalents will be presented. However there can be several challenges faced by the end user in assembly of these similar packages. This paper will cover the benefits of a newly developed package and how the challenges faced in the assembly downstream processes are addressed. Main assembly material consumption reduction includes wire and mold compound. Details of benefits of the relevant assembly processes would be covered including actual comparison.