• DocumentCode
    503191
  • Title

    Influence of the fabrication errors on multilayer thick film circuits

  • Author

    Ali, Wesam ; Min, Chunwei

  • Author_Institution
    Public Authority of Appl. Educ. & Training, Coll. of Technol. Studies, Shuwaikh, Kuwait
  • fYear
    2009
  • fDate
    15-18 June 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The effects of fabrication errors in multilayer millimetre-wave components have been investigated, both through simulations and measurements on practical circuits. This paper provides useful guidelines to the circuit designers on the magnitude of fabrication errors that are acceptable, and presents data not previously reported in the literature. A particularly significant error that was quantified was that of skew between conductors on different layers, where it was found that a skew angle of only 0.1deg resulted in very significant changes in bandwidth and insertion loss. The work was supported by a detailed investigation on a 35GHz, multilayer edge-coupled band-pass filter, which was fabricated on alumina substrates using photoimageable thick film process.
  • Keywords
    alumina; band-pass filters; conductors (electric); millimetre wave circuits; substrates; thick film circuits; Al2O3; alumina substrates; circuit designers; conductors; edge-coupled band-pass filter; fabrication errors; multilayer millimetre-wave components; multilayer thick film circuits; photoimageable thick film; Band pass filters; Bandwidth; Circuit simulation; Conductors; Fabrication; Guidelines; Insertion loss; Nonhomogeneous media; Substrates; Thick film circuits; Fabrication Error; Millimetre-Wave; Multilayer; Photoimageable Thick Film Technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics and Packaging Conference, 2009. EMPC 2009. European
  • Conference_Location
    Rimini
  • Print_ISBN
    978-1-4244-4722-0
  • Electronic_ISBN
    978-0-6152-9868-9
  • Type

    conf

  • Filename
    5272955