DocumentCode
503191
Title
Influence of the fabrication errors on multilayer thick film circuits
Author
Ali, Wesam ; Min, Chunwei
Author_Institution
Public Authority of Appl. Educ. & Training, Coll. of Technol. Studies, Shuwaikh, Kuwait
fYear
2009
fDate
15-18 June 2009
Firstpage
1
Lastpage
4
Abstract
The effects of fabrication errors in multilayer millimetre-wave components have been investigated, both through simulations and measurements on practical circuits. This paper provides useful guidelines to the circuit designers on the magnitude of fabrication errors that are acceptable, and presents data not previously reported in the literature. A particularly significant error that was quantified was that of skew between conductors on different layers, where it was found that a skew angle of only 0.1deg resulted in very significant changes in bandwidth and insertion loss. The work was supported by a detailed investigation on a 35GHz, multilayer edge-coupled band-pass filter, which was fabricated on alumina substrates using photoimageable thick film process.
Keywords
alumina; band-pass filters; conductors (electric); millimetre wave circuits; substrates; thick film circuits; Al2O3; alumina substrates; circuit designers; conductors; edge-coupled band-pass filter; fabrication errors; multilayer millimetre-wave components; multilayer thick film circuits; photoimageable thick film; Band pass filters; Bandwidth; Circuit simulation; Conductors; Fabrication; Guidelines; Insertion loss; Nonhomogeneous media; Substrates; Thick film circuits; Fabrication Error; Millimetre-Wave; Multilayer; Photoimageable Thick Film Technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics and Packaging Conference, 2009. EMPC 2009. European
Conference_Location
Rimini
Print_ISBN
978-1-4244-4722-0
Electronic_ISBN
978-0-6152-9868-9
Type
conf
Filename
5272955
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