• DocumentCode
    503196
  • Title

    Characterization of PTC resistor pastes applied in LTCC technology.

  • Author

    Vanek, J. ; Smetana, W. ; Weilguni, M. ; Szendiuch, I.

  • Author_Institution
    Dept. of Microelectron., Brno Univ. of Technol., Brno, Czech Republic
  • fYear
    2009
  • fDate
    15-18 June 2009
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    This study deals with analyses of PTC (positive temperature coefficient) thick film resistor elements applied in LTCC (low temperature co-fired ceramics) technology. This study concerns the characterization of the electrical performance of PTC-elements placed in a different arrangement on a LTCC-multilayer substrate. Resistors are built-up on LTCC ceramic substrates and sintered in different configurations - on the surface of LTCC tape, in structure with embedded air cavity and co-fired in between two tapes. Three different cermet (ceramic -metallic) based thermistor compositions are used for this study. Electrical measurements were carried out in order to determine the temperature profile of the electrical resistance. TCR (Temperature Coefficient of Electrical Resistance) and the length / width ratio dependence on sheet resistance are evaluated. The influence of sintered configuration on the sheet resistance and TCR is discussed.
  • Keywords
    ceramic packaging; multilayers; sintering; thermistors; thick film resistors; LTCC technology; PTC resistor; electrical measurement; low temperature co-fired ceramics; multilayer substrate; positive temperature coefficient; sheet resistance; sintered configuration; thermistor composition; thick film resistor; Ceramics; Electric resistance; Electric variables measurement; Electrical resistance measurement; Resistors; Substrates; Surface resistance; Temperature; Thermistors; Thick films; LTCC; PTC paste; TCR; resistor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics and Packaging Conference, 2009. EMPC 2009. European
  • Conference_Location
    Rimini
  • Print_ISBN
    978-1-4244-4722-0
  • Electronic_ISBN
    978-0-6152-9868-9
  • Type

    conf

  • Filename
    5272960