Title :
Design and fabrication of corrosion and humidity sensors for performance evaluation of chip scale hermetic packages for biomedical implantable devices
Author :
Saeidi, Nooshin ; Demosthenous, Andreas ; Donaldson, Nick ; Alderman, John
Author_Institution :
Univ. Coll. London, London, UK
Abstract :
In this paper we report on the development of a set of test chips that can be used to verify the sealing techniques with biomedical implants as their target application. These test chips have been designed and fabricated based on the Tyndall´s in-house CMOS 1.5 micron technology. Each chip includes humidity, temperature and/or corrosion sensors. Different designs and sizes have been considered for these sensors to compare the sensors sensitivity and to select the optimum ones for the final chip. The sensors are being tested and the results obtained for two of the humidity sensors are presented.
Keywords :
CMOS integrated circuits; biomedical electronics; biomedical equipment; chip scale packaging; corrosion testing; humidity sensors; temperature sensors; CMOS technology; biomedical implantable device; chip scale hermetic package; corrosion sensor; humidity sensor; size 1.5 micron; temperature sensor; Biosensors; CMOS technology; Chip scale packaging; Corrosion; Detectors; Fabrication; Humidity; Polyimides; Temperature sensors; Testing; Biomedical Packaging; Capacitive Humidity Sensors; Hermeticity Testing; Test Chip;
Conference_Titel :
Microelectronics and Packaging Conference, 2009. EMPC 2009. European
Conference_Location :
Rimini
Print_ISBN :
978-1-4244-4722-0
Electronic_ISBN :
978-0-6152-9868-9
