Design and fabrication of corrosion and humidity sensors for performance evaluation of chip scale hermetic packages for biomedical implantable devices

Author

Saeidi, Nooshin ; Demosthenous, Andreas ; Donaldson, Nick ; Alderman, John

Author_Institution

Univ. Coll. London, London, UK

fYear

2009

fDate

15-18 June 2009

Firstpage

1

Lastpage

4

Abstract

In this paper we report on the development of a set of test chips that can be used to verify the sealing techniques with biomedical implants as their target application. These test chips have been designed and fabricated based on the Tyndall´s in-house CMOS 1.5 micron technology. Each chip includes humidity, temperature and/or corrosion sensors. Different designs and sizes have been considered for these sensors to compare the sensors sensitivity and to select the optimum ones for the final chip. The sensors are being tested and the results obtained for two of the humidity sensors are presented.

Keywords

CMOS integrated circuits; biomedical electronics; biomedical equipment; chip scale packaging; corrosion testing; humidity sensors; temperature sensors; CMOS technology; biomedical implantable device; chip scale hermetic package; corrosion sensor; humidity sensor; size 1.5 micron; temperature sensor; Biosensors; CMOS technology; Chip scale packaging; Corrosion; Detectors; Fabrication; Humidity; Polyimides; Temperature sensors; Testing; Biomedical Packaging; Capacitive Humidity Sensors; Hermeticity Testing; Test Chip;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronics and Packaging Conference, 2009. EMPC 2009. European

Conference_Location

Rimini

Print_ISBN

978-1-4244-4722-0

Electronic_ISBN

978-0-6152-9868-9

Type

conf

Filename

5272975