DocumentCode
50392
Title
Letter from the Editor
Volume
4
Issue
1
fYear
2015
fDate
1st Quarter 2015
Firstpage
4
Lastpage
4
Abstract
Many of us have recently returned from a very successful 2015 IEEE Symposium on Electromagnetic Compatibility (EMC) and Signal Integrity (SI) in Santa Clara, California. It was a great week of technical presentations and exhibits, social activities and networking. I heard several times how much people enjoyed the mild climate of sunny California (especially from those who traveled there from the eastern United States). Symposium general chair Caroline Chan and her symposium committee are to be commended for a job well done. You´ll find several scenes from the symposium on page 112 of this magazine. This should whet your appetite for more detailed information on the symposium. That will be provided in the next issue of this magazine!
fLanguage
English
Journal_Title
Electromagnetic Compatibility Magazine, IEEE
Publisher
ieee
ISSN
2162-2264
Type
jour
DOI
10.1109/MEMC.2015.7098458
Filename
7098458
Link To Document