DocumentCode :
50392
Title :
Letter from the Editor
Volume :
4
Issue :
1
fYear :
2015
fDate :
1st Quarter 2015
Firstpage :
4
Lastpage :
4
Abstract :
Many of us have recently returned from a very successful 2015 IEEE Symposium on Electromagnetic Compatibility (EMC) and Signal Integrity (SI) in Santa Clara, California. It was a great week of technical presentations and exhibits, social activities and networking. I heard several times how much people enjoyed the mild climate of sunny California (especially from those who traveled there from the eastern United States). Symposium general chair Caroline Chan and her symposium committee are to be commended for a job well done. You´ll find several scenes from the symposium on page 112 of this magazine. This should whet your appetite for more detailed information on the symposium. That will be provided in the next issue of this magazine!
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility Magazine, IEEE
Publisher :
ieee
ISSN :
2162-2264
Type :
jour
DOI :
10.1109/MEMC.2015.7098458
Filename :
7098458
Link To Document :
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