• DocumentCode
    50392
  • Title

    Letter from the Editor

  • Volume
    4
  • Issue
    1
  • fYear
    2015
  • fDate
    1st Quarter 2015
  • Firstpage
    4
  • Lastpage
    4
  • Abstract
    Many of us have recently returned from a very successful 2015 IEEE Symposium on Electromagnetic Compatibility (EMC) and Signal Integrity (SI) in Santa Clara, California. It was a great week of technical presentations and exhibits, social activities and networking. I heard several times how much people enjoyed the mild climate of sunny California (especially from those who traveled there from the eastern United States). Symposium general chair Caroline Chan and her symposium committee are to be commended for a job well done. You´ll find several scenes from the symposium on page 112 of this magazine. This should whet your appetite for more detailed information on the symposium. That will be provided in the next issue of this magazine!
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    2162-2264
  • Type

    jour

  • DOI
    10.1109/MEMC.2015.7098458
  • Filename
    7098458