• DocumentCode
    504514
  • Title

    An emissivity-invariant condition of silicon wafers and its application to radiation thermometry

  • Author

    Iuchi, Tohru ; Gogami, Atsushi

  • Author_Institution
    Dept. of Mech. Eng., Toyo Univ., Saitama, Japan
  • fYear
    2009
  • fDate
    18-21 Aug. 2009
  • Firstpage
    2806
  • Lastpage
    2811
  • Abstract
    The emissivity behavior of a silicon wafer is simulated using a simple modeling of the spectral, directional and polarization characteristics of thermal radiation. This study reveals that the p-polarized spectral emissivity of the silicon wafer at a specified direction remains constant. Then, subsequent experiments confirmed the simulated results that the p-polarized emissivity of silicon wafers is maintained to be 0.83 at an angle of 55.4deg and a wavelength of 0.9 mum in spite of wide variations in oxide film thickness from 0 to 950 nm, temperature over 900 K as well as resistivity from 0.01 to 2000 Omegacm relevant to impurity concentrations doped into the silicon wafer. The overall extended uncertainty (k =2) of the temperature measurement is estimated to be 3.82 K over 900 K at the moment. This result is expected to enable significantly more accurate in situ radiation thermometry of silicon wafers in real manufacturing processes.
  • Keywords
    electrical resistivity; elemental semiconductors; emissivity; semiconductor device manufacture; silicon; silicon compounds; substrates; thermometers; Si; SiO2; directional thermal radiation; emissivity-invariant condition; in situ radiation thermometry; oxide film thickness; p-polarized spectral emissivity; resistivity; silicon wafers; thermal radiation polarization; Conductivity; Impurities; Manufacturing processes; Optical films; Polarization; Semiconductor device modeling; Semiconductor films; Semiconductor process modeling; Silicon; Temperature measurement; emissivity; polarization; silicon wafer;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ICCAS-SICE, 2009
  • Conference_Location
    Fukuoka
  • Print_ISBN
    978-4-907764-34-0
  • Electronic_ISBN
    978-4-907764-33-3
  • Type

    conf

  • Filename
    5333864