Presentation and status of the NANOPACK project

NANOPACK - Nano Packaging Technology for Interconnect and Heat Dissipation - is a European large-scale integrating project aiming at the development of new technologies and materials for low thermal resistance interfaces and electrical interconnects, by exploring the capabilities offered by nanotechnologies such as carbon nanotubes, nanoparticles and nano-structured surfaces, and by using different enhancing contact formation mechanisms, compatible with high volume manufacturing technologies. Several key research areas relative to thermal management, interconnect and packaging are addressed in the project by European industrial and academic partners: thermal interface materials, assembly, reliability and characterisation, supported by modeling and simulations. After an overview of NANOPACK, a status of the project progress is presenteed in these different fields.