DocumentCode
505496
Title
Thermo-mechanical reliability loop in device modeling
Author
Bieniek, T. ; Janczyk, G. ; Grabiec, P. ; Szynka, J.
Author_Institution
Inst. of Electron Technol., Warsaw, Poland
fYear
2009
fDate
7-9 Oct. 2009
Firstpage
84
Lastpage
86
Abstract
3D device integration faces the designers with new thermo-mechanical design and device exploitation problems. Temperature dependent mechanical stress spreading across the device affects its performance. This paper discusses selected performance and reliability issues related device the mechanical stress and temperature influence.
Keywords
micromechanical devices; reliability; 3D device integration; MEMS-MOEMS device; device exploitation problems; device modeling; temperature dependent mechanical stress; thermo-mechanical reliability loop; Assembly; Corona; Micromechanical devices; Robustness; Silicon; Substrates; Temperature dependence; Thermal stresses; Thermomechanical processes; Through-silicon vias; Thermo-mechanical modeling; device reliability; integrated modeling; stress affection;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on
Conference_Location
Leuven
Print_ISBN
978-1-4244-5881-3
Type
conf
Filename
5340073
Link To Document