Title :
Thermo-mechanical reliability loop in device modeling
Author :
Bieniek, T. ; Janczyk, G. ; Grabiec, P. ; Szynka, J.
Author_Institution :
Inst. of Electron Technol., Warsaw, Poland
Abstract :
3D device integration faces the designers with new thermo-mechanical design and device exploitation problems. Temperature dependent mechanical stress spreading across the device affects its performance. This paper discusses selected performance and reliability issues related device the mechanical stress and temperature influence.
Keywords :
micromechanical devices; reliability; 3D device integration; MEMS-MOEMS device; device exploitation problems; device modeling; temperature dependent mechanical stress; thermo-mechanical reliability loop; Assembly; Corona; Micromechanical devices; Robustness; Silicon; Substrates; Temperature dependence; Thermal stresses; Thermomechanical processes; Through-silicon vias; Thermo-mechanical modeling; device reliability; integrated modeling; stress affection;
Conference_Titel :
Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on
Conference_Location :
Leuven
Print_ISBN :
978-1-4244-5881-3
