Practical study of temperature distribution in a thermal test integrated circuit

Author

Janicki, M. ; Szermer, M. ; Klab, S. ; Kulesza, Z. ; Napieralski, A.

Author_Institution

Dept. of Microelectron. & Comput. Sci., Tech. Univ. of Lodz, Lodz, Poland

fYear

2009

fDate

7-9 Oct. 2009

Firstpage

136

Lastpage

139

Abstract

This paper presents measurements and simulations of a test integrated circuit. The circuit contains a matrix of heat sources and a set of temperature sensors, what renders possible measurement of circuit temperature in real cooling conditions inside a closed package. The measurements are validated for different patterns of power dissipation and cooling conditions with numerical simulations. Based on the presented results, the influence of circuit topology on temperature distribution and its impact on the possibility of heat source temperature estimation are discussed.

Keywords

integrated circuit testing; numerical analysis; temperature measurement; circuit temperature; circuit topology; cooling conditions; heat source temperature; numerical simulations; power dissipation; temperature distribution; temperature sensors; thermal test integrated circuit; Circuit simulation; Circuit testing; Cooling; Integrated circuit measurements; Integrated circuit packaging; Integrated circuit testing; Power measurement; Temperature distribution; Temperature measurement; Temperature sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on

Conference_Location

Leuven

Print_ISBN

978-1-4244-5881-3

Type

conf

Filename

5340076