Electro-thermal simulation: a new subsystem in Mentor Graphics IC Design flow

Author

Petrosjanc, K.O. ; Ryabov, N.I. ; Kharitonov, I.A. ; Kozynko, P.A.

Author_Institution

Electron. & Electr. Eng. Dept., Moscow State Inst. of Electron. & Math., Moscow, Russia

fYear

2009

fDate

7-9 Oct. 2009

Firstpage

70

Lastpage

74

Abstract

New electro-thermal simulation subsystem was introduced into Mentor Graphics IC Design flow. The subsystem incorporates IC thermal simulation tool ldquoOverheatrdquo, dispatcher ldquoETh SimCouplerrdquo as the simulation manager and layout converter ldquoETh Model Generatorrdquo. Application example of power voltage regulator IC simulation is described. A good agreement between simulated and IR-camera measured temperature pictures is achieved.

Keywords

integrated circuit design; low-power electronics; thermal management (packaging); IC thermal simulation tool; Mentor Graphics IC Design flow; electro-thermal simulation; Analog integrated circuits; Circuit simulation; Computational modeling; Electronic packaging thermal management; Electrothermal effects; Graphics; Integrated circuit layout; Integrated circuit modeling; Temperature sensors; Thermal management; CAD; Electro-thermal simulation; IC;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on

Conference_Location

Leuven

Print_ISBN

978-1-4244-5881-3

Type

conf

Filename

5340085