DocumentCode
50553
Title
Message from the outgoing Editor-in-Chief
Author
Moon, Un-Ku
Author_Institution
Oregon State University, Corvallis, OR, USA
Volume
48
Issue
8
fYear
2013
fDate
Aug. 2013
Firstpage
1767
Lastpage
1767
Abstract
The outgoing Editor-in-Cheif´s (EiC´s) three-year term serving the IEEE JOURNAL OF SOLID-STATE CIRCUITS has now come to a close. He states that it has been a pleasure to hold this post and certainly a very rewarding experience. While upholding our own finest standard demanded by the Solid-State Circuits community, our Journal continues to be the most downloaded journal in IEEE Xplore as well as being the most referred journal in US Patents. All this was made possible only because of the continued support of many individuals who make the Journal what it is.
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/JSSC.2013.2272115
Filename
6564410
Link To Document