Title :
Effect of delay in package traces on CDM stress and peak current
Author :
Kireev, Vassili ; Karp, James ; Hart, Michael ; Jeong, Steve ; Upadhyaya, Parag
Author_Institution :
Xilinx Inc., San Jose, CA, USA
fDate :
Aug. 30 2009-Sept. 4 2009
Abstract :
CDM stress and measured current were analyzed with respect to delay in package traces. A novel wave propagation model for CDM event is proposed. Measured CDM current is the superposition of two pulses: incident and reflected from the die. CDM peak current is lower than CDM stress for pins with longer package traces.
Keywords :
packaging; statistical analysis; CDM peak current; CDM stress; package trace delay; pins; statistical analysis; wave propagation model; Analytical models; Bonding; Current measurement; Delay effects; Packaging; Parasitic capacitance; Pins; Pulse measurements; Stress measurement; Wire;
Conference_Titel :
EOS/ESD Symposium, 2009 31st
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-58537-176-1
Electronic_ISBN :
978-1-58537-176-1
