Title :
CDM ESD current characterization — Package variability effects and comparison to die-level CDM
Author :
Righter, Alan W. ; Salcedo, Javier A. ; Olney, Andrew H. ; Weyl, Thorsten
Author_Institution :
Analog Devices, Wilmington, MA, USA
fDate :
Aug. 30 2009-Sept. 4 2009
Abstract :
Analysis of Charged Device Model (CDM) current waveforms on multiple package options / styles shows significant variation with package size / pin count, package physical characteristics and pin location. Die-level CDM analysis shows much higher CDM peak current compared to their packaged counterparts. Thus, package-level CDM results cannot be substituted for die-level CDM results.
Keywords :
electrostatic discharge; integrated circuit packaging; integrated circuit testing; CDM ESD current characterization; charged device model current waveforms; die-level CDM; integrated circuits testing; multiple package; package physical characteristics; package variability effects; pin count; pin location; Chip scale packaging; Circuit testing; Electrostatic discharge; Integrated circuit modeling; Integrated circuit packaging; Integrated circuit testing; Particle measurements; System testing; Voltage; Wafer scale integration;
Conference_Titel :
EOS/ESD Symposium, 2009 31st
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-58537-176-1
Electronic_ISBN :
978-1-58537-176-1
