Prospects of carbon nanomaterials in VLSI for interconnections and energy storage

Author

Banerjee, Kaustav ; Li, Hong ; Xu, Chuan

Author_Institution

Dept. of Electr. & Comput. Eng., Univ. of California, Santa Barbara, CA, USA

fYear

2009

fDate

Aug. 30 2009-Sept. 4 2009

Firstpage

1

Lastpage

10

Abstract

Carbon nanomaterials (such as carbon nanotubes (CNTs) and graphene nanoribbons (GNRs)) are being actively investigated f or possible use in ICs due to their promising electrical, thermal an d mechanical properties. This paper discusses their prospects as interconnects and high-density energy storage elements, from both modeling and fabrication perspectives. It al so highlights the possible applications of these nano materials in off- chip wiring an d packaging, ESD protection, as well as in emerging 3-dimensional integrated circuits.

Keywords

VLSI; carbon nanotubes; electrostatic discharge; graphene; integrated circuit interconnections; integrated circuit packaging; nanoelectronics; 3-dimensional integrated circuits; C; ESD protection; VLSI; carbon nanomaterials; carbon nanotubes; electrostatic discharge protection; graphene nanoribbons; high-density energy storage elements; interconnects; off-chip wiring; packaging; Carbon nanotubes; Chemical elements; Energy storage; Fabrication; Integrated circuit interconnections; Integrated circuit packaging; Mechanical factors; Nanomaterials; Very large scale integration; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

EOS/ESD Symposium, 2009 31st

Conference_Location

Anaheim, CA

Print_ISBN

978-1-58537-176-1

Electronic_ISBN

978-1-58537-176-1

Type

conf

Filename

5340152