DocumentCode
505599
Title
Efficient optoelectronic de-embedding for VCSEL intrinsic response extraction
Author
Bacou, Alexandre ; Hayat, Ahmad ; Rissons, Angélique ; Mollier, Jean-Claude ; Iakovlev, Vladimir ; Sirbu, Alexei ; Kapon, Eli
Author_Institution
Lab. of microwaves & Optoelectron., Inst. Super. de l´´Aeronautique et de l´´Espace, Toulouse, France
fYear
2009
fDate
14-16 Oct. 2009
Firstpage
1
Lastpage
4
Abstract
In this present work, we propose a new method to remove the parasitics contribution to the VCSEL chip response, in order to obtain the intrinsic transmission behavior. It has been observed that the S11 reflection coefficient of the chip is only due to the electrical access to the chip composed by the transmission line and cavity contacts. This allows us to decompose the chip into two cascaded subsystems representing the electrical access and the optical cavity respectively. An equivalent electrical circuit is developed for the electrical access behavior and, combined with the transfer matrix formalism, it becomes possible to remove the parasitics contribution from the measured S21 response. In this way, the intrinsic 3-dB bandwidth of the VCSEL can be determined.
Keywords
equivalent circuits; integrated optoelectronics; microwave photonics; reflectivity; semiconductor lasers; surface emitting lasers; transmission lines; S11 reflection coefficient; S21 response; cascaded subsystems; double intra-cavity contact VCSEL; electrical access; equivalent electrical circuit; intrinsic response extraction; intrinsic transmission behavior; optical cavity; optoelectronic de-embedding; transfer matrix formalism; transmission line; vertical-cavity surface-emitting lasers; Bandwidth; Frequency modulation; Laboratories; Optical fiber networks; Power transmission lines; Semiconductor device measurement; Surface emitting lasers; Transmission line matrix methods; Vertical cavity surface emitting lasers; Wavelength measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Photonics, 2009. MWP '09. International Topical Meeting on
Conference_Location
Valencia
Print_ISBN
978-1-4244-4788-6
Type
conf
Filename
5342669
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