Title :
Optical and thermal analysis for a modified flip-chip Light Emitted Diode
Author :
Wang, Chuen-Ching ; Yang, Wen-Ren ; Chen, Jin-Jia ; Shih, Wei-Wen ; Wang, Ju, I ; Guo, Tsung-Yi ; Huang, Kwang-Long
Author_Institution :
Dept. of Electr. Eng., Changhua Univ. of Educ., Changhua, Taiwan
fDate :
Oct. 30 2008-Nov. 2 2008
Abstract :
The proposed design for modified flip-chip LED (light emitting diode) has average coupling efficiency of 49.6% for misalignment of 0.4~3 mm. The designed ambient environment also improves the thermal efficiency by factor of 1.6.
Keywords :
flip-chip devices; light emitting diodes; coupling efficiency; modified flip-chip light emitted diode; optical analysis; thermal analysis; Aluminum; Lenses; Light emitting diodes; Optical coupling; Optical design; Optical fibers; Optical refraction; Packaging; Refractive index; Stimulated emission;
Conference_Titel :
Optical Fiber Communication & Optoelectronic Exposition & Conference, 2008. AOE 2008. Asia
Conference_Location :
Shanghai
Print_ISBN :
978-1-55752-863-6
Electronic_ISBN :
978-1-55752-863-6
