DocumentCode
506531
Title
Smart packaging: printed intelligence in high volume packaging
Author
Kuusisto, Jani-Mikael
Author_Institution
IET Seminar on Polymer Electronics, UK
fYear
2009
fDate
21-21 April 2009
Firstpage
1
Lastpage
27
Abstract
• Smart packaging shows significant market growth potential. • Organic electronics and printed intelligence show technological developments which can significantly expand the market for smart packaging. • Increasing focus required on smart packaging applications.
fLanguage
English
Publisher
iet
Conference_Titel
Polymer Electronics: Towards the Future, 2009 IET Seminar on
Conference_Location
London, UK
Print_ISBN
978-1-84919-122-7
Type
conf
Filename
5357595
Link To Document