DocumentCode :
506537
Title :
Prediction of the mechanical properties of ceramic die material with artificial neural network and genetic algorithm
Author :
Zhang, Jingjie ; Yi, Mingdong ; Xu, Chonghai ; Jiang, Zhenyu
Author_Institution :
Sch. of Mech. Eng., Shandong Inst. of Light Ind., Jinan, China
Volume :
1
fYear :
2009
fDate :
20-22 Nov. 2009
Firstpage :
603
Lastpage :
607
Abstract :
This paper presents a connectionist approach using back-propagation artificial neural network (BP) and genetic algorithm (GA) to predict the mechanical properties of ceramic die material. This method is using GA to optimize BP, including how to train the initial connection weights of network and to determine the threshold values. In the analysis, mechanical properties of ceramic die material are optimized while its composition is assumed to be predefined. Various output parameters are considered in the optimization analysis, including hardness, flexural strength and fracture toughness in the optimization analysis. And the input parameters are composition of a kind of material. Results from experiment simulation tool are utilized to train and test the BP-GA optimization approach. The analysis indicates that the BP-GA approach offers a robust and efficient method of optimizing the mechanical properties of ceramic die material when improved neural networks are utilized instead of neural networks.
Keywords :
backpropagation; ceramics; genetic algorithms; mechanical engineering computing; mechanical properties; neural nets; back-propagation artificial neural network; ceramic die material; genetic algorithm; mechanical properties; optimization analysis; Artificial neural networks; Biological neural networks; Ceramics industry; Composite materials; Electronic mail; Genetic algorithms; Mechanical engineering; Mechanical factors; Neurons; Optimization methods; BP; GA; ceramic die material; component; mechanical property;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Intelligent Computing and Intelligent Systems, 2009. ICIS 2009. IEEE International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-4754-1
Electronic_ISBN :
978-1-4244-4738-1
Type :
conf
DOI :
10.1109/ICICISYS.2009.5357604
Filename :
5357604
Link To Document :
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