Title :
Nanoelectromechanical (NEM) relays integrated with CMOS SRAM for improved stability and low leakage
Author :
Chong, Soogine ; Akarvardar, Kerem ; Parsa, Roozbeh ; Yoon, Jun Bo ; Howe, Roger T. ; Mitra, Subhasish ; Wong, H. S Philip
Author_Institution :
Dept. of Electr. Eng., Stanford Univ. Stanford, Stanford, CA, USA
Abstract :
We present a hybrid nanoelectromechanical (NEM)/CMOS static random access memory (SRAM) cell, in which the two pull-down transistors of a conventional CMOS six transistor (6T) SRAM cell are replaced with NEM relays. This SRAM cell utilizes the infinite subthreshold slope and hysteretic properties of NEM relays to dramatically increase the cell stability compared to the conventional CMOS 6T SRAM cells. It also utilizes the zero off-state leakage of NEM relays to significantly decrease static power dissipation. The structure is designed so that the relatively long mechanical delay of the NEM relays does not result in performance degradation. Circuit simulations are performed using a VerilogA model of a NEM relay. Compared to a 65 nm CMOS 6T SRAM cell, when 10 nm-gap NEM relays (pull-in voltage = 0.8 V, pull-out voltage = 0.2 V, on resistance = 1 k¿) are integrated, hold and read static noise margin (SNM) improve by ~110% and ~250%, respectively. In addition, static power dissipation decreases by ~85%. The write delay decreases by ~60%, while read delay decreases by ~10%. The advantages in SNM and static power dissipation are expected to increase with scaling.
Keywords :
CMOS memory circuits; SRAM chips; circuit simulation; delays; hardware description languages; integrated circuit noise; nanoelectromechanical devices; relays; CMOS static random access memory cell; CMOS transistor SRAM cell; NEM relays; VerilogA model; circuit simulations; hold static noise margin; hysteretic properties; infinite subthreshold slope; mechanical delay; nanoelectromechanical relays; off-state leakage; performance degradation; read delay; read static noise margin; resistance 1 kohm; size 65 nm; static power dissipation; voltage 0.2 V; voltage 0.8 V; write delay; Circuit simulation; Circuit stability; Degradation; Delay; Hysteresis; Power dissipation; Random access memory; Relays; SRAM chips; Voltage;
Conference_Titel :
Computer-Aided Design - Digest of Technical Papers, 2009. ICCAD 2009. IEEE/ACM International Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-60558-800-1
Electronic_ISBN :
1092-3152