• DocumentCode
    507415
  • Title

    Nanoelectromechanical (NEM) relays integrated with CMOS SRAM for improved stability and low leakage

  • Author

    Chong, Soogine ; Akarvardar, Kerem ; Parsa, Roozbeh ; Yoon, Jun Bo ; Howe, Roger T. ; Mitra, Subhasish ; Wong, H. S Philip

  • Author_Institution
    Dept. of Electr. Eng., Stanford Univ. Stanford, Stanford, CA, USA
  • fYear
    2009
  • fDate
    2-5 Nov. 2009
  • Firstpage
    478
  • Lastpage
    484
  • Abstract
    We present a hybrid nanoelectromechanical (NEM)/CMOS static random access memory (SRAM) cell, in which the two pull-down transistors of a conventional CMOS six transistor (6T) SRAM cell are replaced with NEM relays. This SRAM cell utilizes the infinite subthreshold slope and hysteretic properties of NEM relays to dramatically increase the cell stability compared to the conventional CMOS 6T SRAM cells. It also utilizes the zero off-state leakage of NEM relays to significantly decrease static power dissipation. The structure is designed so that the relatively long mechanical delay of the NEM relays does not result in performance degradation. Circuit simulations are performed using a VerilogA model of a NEM relay. Compared to a 65 nm CMOS 6T SRAM cell, when 10 nm-gap NEM relays (pull-in voltage = 0.8 V, pull-out voltage = 0.2 V, on resistance = 1 k¿) are integrated, hold and read static noise margin (SNM) improve by ~110% and ~250%, respectively. In addition, static power dissipation decreases by ~85%. The write delay decreases by ~60%, while read delay decreases by ~10%. The advantages in SNM and static power dissipation are expected to increase with scaling.
  • Keywords
    CMOS memory circuits; SRAM chips; circuit simulation; delays; hardware description languages; integrated circuit noise; nanoelectromechanical devices; relays; CMOS static random access memory cell; CMOS transistor SRAM cell; NEM relays; VerilogA model; circuit simulations; hold static noise margin; hysteretic properties; infinite subthreshold slope; mechanical delay; nanoelectromechanical relays; off-state leakage; performance degradation; read delay; read static noise margin; resistance 1 kohm; size 65 nm; static power dissipation; voltage 0.2 V; voltage 0.8 V; write delay; Circuit simulation; Circuit stability; Degradation; Delay; Hysteresis; Power dissipation; Random access memory; Relays; SRAM chips; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design - Digest of Technical Papers, 2009. ICCAD 2009. IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Print_ISBN
    978-1-60558-800-1
  • Electronic_ISBN
    1092-3152
  • Type

    conf

  • Filename
    5361249