• DocumentCode
    507437
  • Title

    Timing model extraction for sequential circuits considering process variations

  • Author

    Li, Bing ; Chen, Ning ; Schlichtmann, Ulf

  • Author_Institution
    Inst. for Electron. Design Autom., Tech. Univ. Munchen, Munich, Germany
  • fYear
    2009
  • fDate
    2-5 Nov. 2009
  • Firstpage
    333
  • Lastpage
    343
  • Abstract
    As semiconductor devices continue to scale down, process variations become more relevant for circuit design. Facing such variations, statistical static timing analysis is introduced to model variations more accurately so that the pessimism in traditional worst case timing analysis is reduced. Because all delays are modeled using correlated random variables, most statistical timing methods are much slower than corner based timing analysis. To speed up statistical timing analysis, we propose a method to extract timing models for flip-flop and latch based sequential circuits respectively. When such a circuit is used as a module in a hierarchical design, the timing model instead of the original circuit is used for timing analysis. The extracted timing models are much smaller than the original circuits. Experiments show that using extracted timing models accelerates timing verification by orders of magnitude compared to previous approaches using flat netlists directly. Accuracy is maintained, however, with the mean and standard deviation of the clock period both showing usually less than 1% error compared to Monte Carlo simulation on a number of benchmark circuits.
  • Keywords
    flip-flops; integrated circuit design; sequential circuits; statistical analysis; synchronisation; timing; flip flop; latch; process variation; sequential circuits; statistical timing analysis; timing model extraction; Acceleration; Circuit synthesis; Clocks; Delay; Flip-flops; Latches; Random variables; Semiconductor devices; Sequential circuits; Timing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design - Digest of Technical Papers, 2009. ICCAD 2009. IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Print_ISBN
    978-1-60558-800-1
  • Electronic_ISBN
    1092-3152
  • Type

    conf

  • Filename
    5361272