DocumentCode :
50744
Title :
IEEE Microwave and Wireless Components Letters information for authors
Volume :
23
Issue :
2
fYear :
2013
fDate :
Feb. 2013
Abstract :
Provides instructions and guidelines to prospective authors who wish to submit manuscripts.
fLanguage :
English
Journal_Title :
Microwave and Wireless Components Letters, IEEE
Publisher :
ieee
ISSN :
1531-1309
Type :
jour
DOI :
10.1109/LMWC.2013.2245274
Filename :
6459020
Link To Document :
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