Numerical Analysis on Stress and Strain in QFP Lead-Free Solder with Temperature Impact

Author

Li Zhi ; Zhao Mei-rong ; You Min ; Lu Wei-bin ; Wang Yun-tao

Author_Institution

Mech. & Electr. Eng. Dept., China Three Gorges Project Corp., Yichang, China

Volume

1

fYear

2009

fDate

16-18 Oct. 2009

Firstpage

214

Lastpage

217

Abstract

To study the relation between the QFP lead-free solder stress and strain accumulation under the condition of the impact of temperature (-55Â°C~125Â°C), Visco-plastic finite element model based upon Anand constitutive equations is established to numerically analyze the interfacial stress of solder formed by three different kinds of solders to the same substrate FR-4. The results shows that the interface stress between three different solders and FR-4 board is different, and 95.5Sn3.8Ag0.7Cu is smaller than 63Sn-37Pb, So 95.5Sn3.8Ag0.7Cu will be helpful for the connecting reliability in electronic package; After circular temperature impact, the joint´s maximum stress formed by 95.5Sn3.8Ag0.7Cu usually accumulated in the middle of both sides and right chamfer; During the temperature cycle, the greatest strain X direction is compression strain.

Keywords

electronics packaging; finite element analysis; soldering; stress-strain relations; viscoplasticity; Anand constitutive equation; FR-4; QFP lead-free solder stress; compression strain; electronic package; interfacial stress; solder strain; temperature impact; visco-plastic finite element model; Capacitive sensors; Differential equations; Electronics packaging; Environmentally friendly manufacturing techniques; Finite element methods; Joining processes; Lead; Numerical analysis; Stress; Temperature; QFP; lead-free solder; numerical simulation; temperature cycles;

fLanguage

English

Publisher

ieee

Conference_Titel

Energy and Environment Technology, 2009. ICEET '09. International Conference on

Conference_Location

Guilin, Guangxi

Print_ISBN

978-0-7695-3819-8

Type

conf

DOI

10.1109/ICEET.2009.58

Filename

5362706