• DocumentCode
    50796
  • Title

    Virtual Voltage Method for Analyzing Shielding Current Density in High-Temperature Superconducting Film With Cracks/Holes

  • Author

    Kamitani, Atsushi ; Takayama, Teruou ; Ikuno, Soichiro

  • Author_Institution
    Grad. Sch. of Sci. & Eng., Yamagata Univ., Yamagata, Japan
  • Volume
    49
  • Issue
    5
  • fYear
    2013
  • fDate
    May-13
  • Firstpage
    1877
  • Lastpage
    1880
  • Abstract
    An accurate numerical method is proposed for calculating the shielding current density in a high-temperature superconducting film containing defects. If the initial-boundary-value problem of the shielding current density is formulated by the T -method, integral forms of Faraday´s law on defect surfaces are also imposed as natural boundary conditions. However, the conditions are not satisfied exactly by a numerical solution and their residuals develop intolerably with a decrease in the film thickness. In order to resolve this problem, the following method is proposed: virtual voltages be applied along the defect surfaces as to have the natural boundary conditions numerically satisfied. A numerical code is developed on the basis of the proposed method, and the influence of a crack on the inductive method or the permanent-magnet method is numerically investigated.
  • Keywords
    Faraday effect; boundary-value problems; cracks; critical current density (superconductivity); crystal defects; finite element analysis; high-temperature superconductors; permanent magnets; superconducting thin films; Faraday law; cracks; defect surfaces; film thickness; high-temperature superconducting films; inductive method; initial-boundary-value problem; natural boundary conditions; numerical code; numerical method; permanent-magnet method; shielding current density calculation; virtual voltage method; Finite-element methods; Newton method; integrodifferential equations; superconducting films;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/TMAG.2013.2239619
  • Filename
    6514569