DocumentCode :
508924
Title :
Effect of Tension Coiler on Temperature Field among Layers for Hot Strip
Author :
Feng, Xianzhang ; Liu, Changhong ; Cui, Yanmei
Author_Institution :
Sch. of Mechatron. Eng., Zhengzhou Inst. of Aeronaut. Ind. Manage., Zhengzhou, China
Volume :
1
fYear :
2009
fDate :
21-22 Nov. 2009
Firstpage :
140
Lastpage :
143
Abstract :
In order to study the distribution rulers of temperature field and stress during strip the coiling. The 2D coupled thermo-mechanical finite element model was established through specialized CAE software, metal deformation and flow as main research context, considering materials mechanics, theoretical mechanics, theory of elastic-plastic mechanics, etc. It can establish the relationship among coiler pressure, friction and initial temperature. Through the initial conditions determine the temperature, force boundary conditions, geometric properties, material properties and contact, etc. And analysis of effect of temperature on stress field under multiple loading conditions. The results show that The greater the friction coefficient, the smaller the temperature change between layers, with the initial temperature the higher the volume, the greater the interlaminar stress, without considering the coefficient of friction strip and internal factors such as heat transfer. It is important to improve the quality of strip steel products.
Keywords :
computer aided engineering; finite element analysis; hot rolling; metallurgical industries; steel; strips; 2D coupled thermo-mechanical finite element model; CAE software; hot strip; strip steel products; temperature field; tension coiler; Computer aided engineering; Context modeling; Deformable models; Finite element methods; Friction; Inorganic materials; Strips; Temperature distribution; Thermal stresses; Thermomechanical processes; coiler pressuree; initial conditions; layers; temperature field; tension coiler;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Intelligent Information Technology Application, 2009. IITA 2009. Third International Symposium on
Conference_Location :
Nanchang
Print_ISBN :
978-0-7695-3859-4
Type :
conf
DOI :
10.1109/IITA.2009.15
Filename :
5368499
Link To Document :
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