Complicated Signal Processing Methods for Very Deep Sub-micro (VDSM) Poly Etching Endpoint Detection

Author

Ren, Hongya ; Wu, Jianzhang ; Yan, Junyin ; Zhang, Jianzhen ; Wang, Wei

Author_Institution

Sch. of Mech. & Civil Eng., China Univercity of Min. & Technol., Beijing, China

Volume

1

fYear

2009

fDate

21-22 Nov. 2009

Firstpage

377

Lastpage

380

Abstract

Difficulties in VDSM poly gate etching process was summarized firstly. Secondly, traditional endpoint detection techniques of optical emission spectroscopy (OES) and interferometer endpoint detection (IEP) were introduced in detail. At last, by constructing new endpoint detection system, and applying multi-robust algorithms, the endpoint is pre-found for the patterned 90 nm wafers which expected give very important guidance to the endpoint detection of sub-90 nm VDSM etching process.

Keywords

light interferometry; nanopatterning; optical information processing; signal processing; spectroscopy; sputter etching; complicated signal processing method; interferometer endpoint detection; multirobust algorithm; optical emission spectroscopy; size 90 nm; very deep submicro poly etching endpoint detection; Etching; Optical detectors; Optical interferometry; Optical signal processing; Plasma applications; Plasma chemistry; Principal component analysis; Signal processing; Signal processing algorithms; Spectroscopy; endpoint detection; sub-90nm;

fLanguage

English

Publisher

ieee

Conference_Titel

Intelligent Information Technology Application, 2009. IITA 2009. Third International Symposium on

Conference_Location

Nanchang

Print_ISBN

978-0-7695-3859-4

Type

conf

DOI

10.1109/IITA.2009.188

Filename

5369630