DocumentCode :
509951
Title :
Enhancing lifetime and security of PCM-based Main Memory with Start-Gap Wear Leveling
Author :
Qureshi, Moinuddin K. ; Karidis, John ; Franceschini, Michele ; Srinivasan, Vijayalakshmi ; Lastras, Luis ; Abali, Bulent
Author_Institution :
T.J. Watson Res. Center, IBM Res., Yorktown Heights, NY, USA
fYear :
2009
fDate :
12-16 Dec. 2009
Firstpage :
14
Lastpage :
23
Abstract :
Phase Change Memory (PCM) is an emerging memory technology that can increase main memory capacity in a cost-effective and power-efficient manner. However, PCM cells can endure only a maximum of 107-108 writes, making a PCM based system have a lifetime of only a few years under ideal conditions. Furthermore, we show that non-uniformity in writes to different cells reduces the achievable lifetime of PCM system by 20×. Writes to PCM cells can be made uniform with Wear-Leveling. Unfortunately, existing wear-leveling techniques require large storage tables and indirection, resulting in significant area and latency overheads. We propose Start-Gap, a simple, novel, and effective wear-leveling technique that uses only two registers. By combining Start-Gap with simple address-space randomization techniques we show that the achievable lifetime of the baseline 16 GB PCM-based system is boosted from 5% (with no wear-leveling) to 97% of the theoretical maximum, while incurring a total storage overhead of less than 13 bytes and obviating the latency overhead of accessing large tables. We also analyze the security vulnerabilities for memory systems that have limited write endurance, showing that under adversarial settings, a PCM-based system can fail in less than one minute. We provide a simple extension to Start-Gap that makes PCM-based systems robust to such malicious attacks.
Keywords :
phase change memories; security of data; PCM-based main memory system; address-space randomization techniques; latency overhead; lifetime enhancement; phase change memory; security vulnerabilities; start-gap wear leveling; storage overhead; write endurance; Costs; Delay; Failure analysis; Phase change materials; Phase change memory; Random access memory; Robustness; Security; Semiconductor device reliability; Semiconductor memory; Endurance; Phase Change Memory; Wear Leveling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microarchitecture, 2009. MICRO-42. 42nd Annual IEEE/ACM International Symposium on
Conference_Location :
New York, NY
ISSN :
1072-4451
Print_ISBN :
978-1-60558-798-1
Type :
conf
Filename :
5375309
Link To Document :
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