DocumentCode
509952
Title
Characterizing flash memory: Anomalies, observations, and applications
Author
Grupp, Laura M. ; Caulfield, Adrian M. ; Coburn, Joel ; Swanson, Steven ; Yaakobi, Eitan ; Siegel, Paul H. ; Wolf, Jack K.
Author_Institution
Dept. of Comput. Sci. & Eng., Univ. of California, San Diego, CA, USA
fYear
2009
fDate
12-16 Dec. 2009
Firstpage
24
Lastpage
33
Abstract
Despite flash memory´s promise, it suffers from many idiosyncrasies such as limited durability, data integrity problems, and asymmetry in operation granularity. As architects, we aim to find ways to overcome these idiosyncrasies while exploiting flash memory´s useful characteristics. To be successful, we must understand the trade-offs between the performance, cost (in both power and dollars), and reliability of flash memory. In addition, we must understand how different usage patterns affect these characteristics. Flash manufacturers provide conservative guidelines about these metrics, and this lack of detail makes it difficult to design systems that fully exploit flash memory´s capabilities. We have empirically characterized flash memory technology from five manufacturers by directly measuring the performance, power, and reliability. We demonstrate that performance varies significantly between vendors, devices, and from publicly available datasheets. We also demonstrate and quantify some unexpected device characteristics and show how we can use them to improve responsiveness and energy consumption of solid state disks by 44% and 13%, respectively, as well as increase flash device lifetime by 5.2x.
Keywords
energy consumption; flash memories; data integrity problems; energy consumption; flash memory reliability; operation granularity; solid state disks; Application software; Costs; Delay; Energy consumption; Error correction; Flash memory; Manufacturing; Permission; Power measurement; Power system reliability; Characterization; Flash Memory; Non-volatile;
fLanguage
English
Publisher
ieee
Conference_Titel
Microarchitecture, 2009. MICRO-42. 42nd Annual IEEE/ACM International Symposium on
Conference_Location
New York, NY
ISSN
1072-4451
Print_ISBN
978-1-60558-798-1
Type
conf
Filename
5375312
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