• DocumentCode
    510171
  • Title

    Numerical Analysis of Transient Heat Transfer of Hollow Block

  • Author

    Wan, Qing ; Dong, Hua ; Zhou, Enze

  • Author_Institution
    Inst. of Environ. & Municipal Eng., Qingdao Technol. Univ., Qingdao, China
  • Volume
    2
  • fYear
    2009
  • fDate
    7-8 Nov. 2009
  • Firstpage
    114
  • Lastpage
    117
  • Abstract
    Numerical simulation was applied to analysing performance of transient heat transfer of hollow block. The paper considered influence of convection and radiation of internal and external of computational domain in the process of analysis. The effect of solar radiation on enclosure structure was added in comprehensive temperature of outdoors, while regions of inner hole adopted nature convection and discrete ordinates radiation model. The results show that internal radiation have a great influence on heat transfer process of hollow block, the thermal resistance value present simple harmonic wave periodic fluctuation under the hypothesis conditions. So the internal radiation must be considered in numerical simulation, the results of simulation of outdoor environment have certain guiding significance for field detection.
  • Keywords
    natural convection; numerical analysis; shapes (structures); solar radiation; structural engineering; thermal resistance; discrete ordinates radiation model; enclosure structure; hollow block; natural convection; numerical analysis; simple harmonic wave periodic fluctuation; solar radiation; thermal resistance; transient heat transfer; Fluctuations; Heat transfer; Numerical analysis; Numerical simulation; Performance analysis; Resistance heating; Solar radiation; Temperature; Thermal resistance; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Artificial Intelligence and Computational Intelligence, 2009. AICI '09. International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-3835-8
  • Electronic_ISBN
    978-0-7695-3816-7
  • Type

    conf

  • DOI
    10.1109/AICI.2009.72
  • Filename
    5376404