DocumentCode
510626
Title
Low-power, high-bandwidth optical interconnects for computing systems
Author
Nakagawa, Shigeru
Author_Institution
IBM Tokyo Research Laboratory, 1623-14 Shimo-tsuruma, Yamato, Kanagawa 242-0852, Japan
fYear
2009
fDate
2-6 Nov. 2009
Firstpage
1
Lastpage
2
Abstract
Power-efficient, high-performance multicore systems require high-bandwidth and low-power I/O, which can not be realized without optics. This paper will review recent progress in optical interconnects, which include low-power, high-speed optical link and high-density, chip-based, high-density optical packaging on optical PCB.
Keywords
Bandwidth; High speed optical techniques; Integrated optics; Multicore processing; Optical computing; Optical fiber communication; Optical interconnections; Optical transmitters; Packaging; Vertical cavity surface emitting lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Communications and Photonics Conference and Exhibition (ACP), 2009 Asia
Conference_Location
Shanghai, China
Print_ISBN
978-1-55752-877-3
Electronic_ISBN
978-1-55752-877-3
Type
conf
Filename
5377292
Link To Document