• DocumentCode
    511772
  • Title

    The novel high efficiency on chip transformers for the CMOS power amplifier

  • Author

    Kim, Ki-Jin ; Lim, Tae Ho ; Ahn, K.H.

  • Author_Institution
    Syst. Packaging Res. Center, Korea Electron. Technol. Inst., Seongnam, South Korea
  • fYear
    2009
  • fDate
    14-16 Dec. 2009
  • Firstpage
    401
  • Lastpage
    404
  • Abstract
    This paper proposes a novel on chip transformer for the purpose of combining output voltage of the high power amplifier in a standard 0.13-¿m TSMC CMOS technology. The transformer adopts multi-finger architecture which provides low insertion loss and allows high current capacity on the transformer. The proposed transformer is estimated and designed by 3-D electromagnetic simulator. Due to the multi-finger structure, the voltage transfer efficiency from input to output at the transformer reaches 81%. To enhance linearity of the PA, cross coupled compensation capacitors are added. With all integration of transformers, baluns, and paralell 4 diff-amps, the prototype class AB power amplifier shows 30 dBm saturation power with 1.8 V supply voltage and 35 dBm with 3 V supply voltage at 2.4 GHz. The output P1dB is 27 dBm with 18% drain efficiency and 30 dBm with 15.6% drain efficiency.
  • Keywords
    CMOS integrated circuits; UHF power amplifiers; baluns; capacitors; differential amplifiers; power transformers; thyristor applications; 3D electromagnetic simulator; CMOS power amplifier; TSMC CMOS technology; baluns; class AB power amplifier; diff-amps; frequency 2.4 GHz; insertion loss; multifinger architecture; multifinger structure; on chip transformer; size 0.13 mum; transformer current capacity; voltage 1.8 V; CMOS technology; High power amplifiers; Impedance matching; Power amplifiers; Power generation; Power supplies; Radiofrequency amplifiers; System-on-a-chip; Transceivers; Transformers; On chip transformer; RF ICs; cmos power amplifiers; passive balun;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Circuits, ISIC '09. Proceedings of the 2009 12th International Symposium on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-9-8108-2468-6
  • Type

    conf

  • Filename
    5403775