• DocumentCode
    511811
  • Title

    Full coverage manufacturing testing for SRAM-based FPGA

  • Author

    Liao, Y.B. ; Li, P. ; Ruan, A.W. ; Li, W. ; Li, W.C.

  • Author_Institution
    State Key Lab. of Electron. Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2009
  • fDate
    14-16 Dec. 2009
  • Firstpage
    478
  • Lastpage
    481
  • Abstract
    Full coverage detection of faults is required for FPGA manufacturing testing. Many researches for FPGA test only focus on algorithms of reduction configuration numbers for a configurable logic blocks (CLB), or interconnect routings without application for manufacturing testing. Taking advantage of flexibility and observability of software in conjunction with high-speed simulation of hardware, SoC co-verification technology based in-house FPGA functional test environment embedded with an in-house computerized tool, ConPlacement, can detect CLBs and interconnect routing of FPGA automatically, exhaustively and repeatedly. The approach to implement full coverage detection of CLB and interconnect routing faults by the FPGA functional test environment is presented in the paper. Experimental results of XC4010E demonstrate that 17 configurations are required to achieve 100% coverage for a FPGA-under-test.
  • Keywords
    SRAM chips; field programmable gate arrays; logic testing; system-on-chip; ConPlacement; FPGA manufacturing testing; SRAM-based FPGA; SoC coverification technology; configurable logic blocks; field programmable gate arrays; hardware high speed simulation; in-house computerized tool; interconnect routing faults; system-on-chip; Application software; Computational modeling; Embedded software; Fault detection; Field programmable gate arrays; Logic testing; Manufacturing; Observability; Routing; Software tools; CLB; FPGA; SOC co-verification; fault; full coverage detection; interconnect routing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Circuits, ISIC '09. Proceedings of the 2009 12th International Symposium on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-9-8108-2468-6
  • Type

    conf

  • Filename
    5403878