• DocumentCode
    511857
  • Title

    High performance HfOx -based resistive RAM devices and its temperature dependent switching

  • Author

    Fang, Zheng ; Yu, Hongyu ; Li, Xiang ; Pey, Kin-Leong ; Liu, Wenjun

  • Author_Institution
    Sch. of EEE, Nanyang Technol. Univ., Singapore, Singapore
  • fYear
    2009
  • fDate
    14-16 Dec. 2009
  • Firstpage
    144
  • Lastpage
    146
  • Abstract
    High performance resistive random access memory (RRAM) based on HfOx has been prepared and its temperature dependant switching has been investigated in this work. It is found that the set and reset voltages decrease with increased temperature, which may be attributed to higher oxygen ion mobility and lower oxygen ions activation potential barrier at the higher temperature. An oxygen vacancy assisted conduction filament formation and rupture can elucidate the switching behavior. Devices also exhibit the multi-bit potentials, which may further increase integration density.
  • Keywords
    hafnium compounds; ion mobility; random-access storage; HfO; high performance resistive random access memory; lower oxygen ions activation potential barrier; oxygen vacancy assisted conduction filament formation; resistive RAM devices; temperature dependent switching; Chemical analysis; Hafnium oxide; MIM capacitors; Random access memory; Semiconductor films; Sputtering; Temperature dependence; Tin; Transmission electron microscopy; Voltage; resistive switching; temperature dependence;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Circuits, ISIC '09. Proceedings of the 2009 12th International Symposium on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-9-8108-2468-6
  • Type

    conf

  • Filename
    5403929