DocumentCode
511857
Title
High performance HfOx -based resistive RAM devices and its temperature dependent switching
Author
Fang, Zheng ; Yu, Hongyu ; Li, Xiang ; Pey, Kin-Leong ; Liu, Wenjun
Author_Institution
Sch. of EEE, Nanyang Technol. Univ., Singapore, Singapore
fYear
2009
fDate
14-16 Dec. 2009
Firstpage
144
Lastpage
146
Abstract
High performance resistive random access memory (RRAM) based on HfOx has been prepared and its temperature dependant switching has been investigated in this work. It is found that the set and reset voltages decrease with increased temperature, which may be attributed to higher oxygen ion mobility and lower oxygen ions activation potential barrier at the higher temperature. An oxygen vacancy assisted conduction filament formation and rupture can elucidate the switching behavior. Devices also exhibit the multi-bit potentials, which may further increase integration density.
Keywords
hafnium compounds; ion mobility; random-access storage; HfO; high performance resistive random access memory; lower oxygen ions activation potential barrier; oxygen vacancy assisted conduction filament formation; resistive RAM devices; temperature dependent switching; Chemical analysis; Hafnium oxide; MIM capacitors; Random access memory; Semiconductor films; Sputtering; Temperature dependence; Tin; Transmission electron microscopy; Voltage; resistive switching; temperature dependence;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Circuits, ISIC '09. Proceedings of the 2009 12th International Symposium on
Conference_Location
Singapore
Print_ISBN
978-9-8108-2468-6
Type
conf
Filename
5403929
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