• DocumentCode
    511873
  • Title

    Information theoretic capacity analysis of single-walled carbon nanotube bundle VLSI interconnects

  • Author

    Rahaman, Md Sajjad ; Chowdhury, Masud H.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Illinois at Chicago, Chicago, IL, USA
  • fYear
    2009
  • fDate
    14-16 Dec. 2009
  • Firstpage
    530
  • Lastpage
    533
  • Abstract
    Conventional approach of copper interconnects has become a major bottleneck for VLSI system performance due to larger delay and increased susceptibility to noise in deep sub-micrometer (DSM) technology. Bundles of single-walled carbon nanotubes (SWCNT) have been proposed as a possible replacement for copper interconnect due to their outstanding conductivity and current-carrying capabilities. This paper presents the signal and data carrying capacity of SWCNT interconnects from information theoretic point of view. Results show SWCNT bundle data bus provides better data handling capacity compared to an 8-bit-wide 0.1-¿m Cu interconnect technology for long (global and intermediate levels) interconnects. It also shows that maximum data transfer rate for SWCNT bundle data bus occurs at around 60 GHz for intermediate and global level interconnects which clearly makes it suitable for future high-speed on-chip interconnect applications.
  • Keywords
    VLSI; carbon nanotubes; integrated circuit interconnections; current-carrying capabilities; deep submicrometer technology; high-speed onchip interconnect applications; information theoretic capacity analysis; single-walled carbon nanotube bundle VLSI interconnects; single-walled carbon nanotubes; size 0.1 mum; Carbon nanotubes; Conductivity; Copper; Crosstalk; Data handling; Electrons; Information analysis; Integrated circuit interconnections; Integrated circuit technology; Very large scale integration; BER; CNT; Capacity; Interconnects;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Circuits, ISIC '09. Proceedings of the 2009 12th International Symposium on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-9-8108-2468-6
  • Type

    conf

  • Filename
    5403945