DocumentCode
511946
Title
Point defects in relaxed and strained Si studied by molecular dynamics method
Author
Chen, Zhihui ; Yu, Zhongyuan ; Lu, Pengfei ; Liu, Yumin
Author_Institution
Key Laboratory of Information Photonics and Optical Communications (Beijing University of Posts and Telecommunications), Ministry of Education, P.O. Box49 (BUPT), 100876, China
Volume
2009-Supplement
fYear
2009
fDate
2-6 Nov. 2009
Firstpage
1
Lastpage
11
Abstract
Molecular dynamics simulations using the Tersoff potential have been performed to investigate the perturbation effects caused by different kinds of the point defects (vacancies and substitutional impurities) on the strained and relaxed Si matrices. Lattice distortion, mean square displacement, pair correlation function and vibrational spectra are studied. It is found that Ge substitution lead to little distortion of the Si matrix. However, vacancy and C substitution lead to more distortion. Diffusion directions of Si atoms around different kinds of point defects are different. When C substitution is introduced in the relaxed Si matrices or Ge substitution is introduced in the strained Si matrices, the system needs longer time to reach equilibrium. The crystallinity and symmetry degree of relaxed Si matrices are more satisfying than those of strained Si matrices after relaxation. Changes of the vibrational spectra caused by vacancy and C substitution are obvious. All above have a great effect on the photoelectric properties of the materials.
Keywords
Crystalline materials; Crystals; Impurities; Lattices; Matrices; Nanoscale devices; Nanostructured materials; Photonics; Semiconductor materials; Vibrations; lattice distortion; mean square displacement; molecular dynamic simulations; nanostructure; optoelectronic materials and devices; pair correlation function; point defects; semiconductor materials; vibrational spectra;
fLanguage
English
Publisher
ieee
Conference_Titel
Communications and Photonics Conference and Exhibition (ACP), 2009 Asia
Conference_Location
Shanghai, China
Print_ISBN
978-1-55752-877-3
Electronic_ISBN
978-1-55752-877-3
Type
conf
Filename
5405194
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